Transducer signal wire termination

ABSTRACT

A transducer signal terminator for providing electrical connections between a plurality of read/write transducer lead wires and a preamplifier includes a substrate having a plurality of layers and has a plurality of intermediate strips. A plurality of head pads are located on the substrate to provide interconnection points. The intermediate strips have a plurality of electrically conductive pads with a hole therein, and each lead wire is electrically attached to a pad on the intermediate strip. Each intermediate strip is placed on the substrate such that each of the holes in the electrically conductive pads is aligned with one of the head pads on the substrate. An electrical connection is then formed between each head pad and a corresponding conductive pad of the intermediate strip.

BACKGROUND OF THE INVENTION

The present invention concerns the electrical connection of the leadwires of a read/write transducer to a preamplifier circuit formed on asubstrate and, more particularly, a method and apparatus for making thatelectrical connection. The invention involves terminating each of thelead wires onto pads of an intermediate strip, the position of each padidentifying the particular lead wires attached, and subsequentlyelectrically connecting the intermediate strip pads to correspondingleads for the preamplifier circuit.

Typically in magnetic disc drives, signals from a read/write transducerare sent to a preamplifier circuit. The preamplifier circuit isgenerally located on an electrically insulating substrate. Previous discdrives use conventional coil (thin-film) read/write transducers, whereinthe read signal is generated by the change in magnetic flux in a smallcoil located in the transducer. The transducer is positioned a minutedistance above the surface of the recording medium or disc. The changein flux is caused by the motion of the underlying magnetic pattern onthe disc surface. The same coil is also utilized by the transducerduring the write process on the disc drive.

Generally two lead wires have been used to complete the electricalcircuit to and from the terminals of the conventional coil transducer.The two lead wires are utilized to carry the electrical signal both inthe read process and the write process, although the read signal ismarkedly different from the write signal. With a conventional coiltransducer, the direction the signal runs (i.e., polarity of theterminals/lead wires) is unimportant, both in the read and the writeprocess. Either lead wire can operate as the positive or negative lead.The two lead wires are not distinct from each other, and can beinterchanged with one another without altering the performance of thesystem. The two lead wires have typically been encased in a singleinsulative or protective tubing running from the transducer to thepre-amplifier, with no mechanism to distinguish one wire from the other.Connection between the transducer terminals and the pre-amplifiercircuit is generally performed by hand alignment and soldering of eachtransducer lead wire to one of two pads on the preamplifier circuit.

Recently, magneto-resister (MR) transducers have been utilized in discdrives. MR transducers generally continue to perform the write functionwith a coil in the transducer as described above. However, the MR readfunction is performed by a separate element in the transducer, a verytiny variable resistor. The variable resistor measures the magnetic fluxplaced on the resistor current due to the magnetism of the recordingmedium. Because separate elements are used for read and write functions,the MR transducer requires four terminals/lead wires rather than two.Additionally, in contrast to conventional coil transducers, MRtransducers are generally sensitive to the direction or polarity ofcurrent flow. A reversal of current flow would disturb the domainalignment within the variable resister element, to the detriment of theMR transducer. Accordingly, the MR terminals/lead wires are designatedas positive read, positive write, negative read and negative write,respectively. This polarity of MR transducer leads assures that thedirection of current flow is nonreversible and in the directionintended.

The use of MR transducers having four polarized leads has createdassembly problems in distinguishing each lead from the others. Wires arenormally identified through coloring of the insulation layer surroundingthe wire. However, this requires multiple spools of wire which increasesthe product cost. Additionally, when automation is desired for makingthe wiring connections, identification of wires through color codingbecomes problematic. Not only must the changing operation betweenvarious spools of colored wire be automated, but the automated equipmentmust also have some sort of photo-sensitive eye or other sensingequipment to distinguish between wire colors. Accordingly, a better wayto identify and distinguish between the lead wires of MR transducers isdesired.

With the advent of MR transducers in disc drives, the read signalstrengths have significantly decreased (in comparison to the read signalstrengths on traditional coil transducers). To compensate for this lackof signal, low impedance preamps have been employed to improve the noisesusceptibility. However, the signal line impedance between thetransducer and the preamplifier becomes critical when applying lowimpedance preamplifiers. The preamplifier circuits for traditional coiltransducers have generally been placed on a base board adjacent to theactuator arm. The signal line impedance of this traditional applicationwould result in a significant reduction in band-width for a lowimpedance preamplifier. A second complication of MR signal line handlingis the quantity of signal lines. The addition of two signal lines for MRtransducers results in double the density of signal runs between thetransducers and the preamplifier over traditional thin film transducerapplication. This increase in signal density provides a greaterpropensity for noise between signal lines ("interchannel noise"). Toreduce the effects of bandwidth reduction and interchannel noise, it isdesired to place the preamplifier as close to the transducers aspossible.

In disc drives having MR transducers, the preamplifier assembly has beenlocated on a rotary arm used to selectively position the transducer overthe desired information storage track on the magnetic media on the disc.For a 31/2 inch drive, the signal run length from the MR transducer to apre-amplifier on the actuator arm is about 11/2 to 13/4 inches, savingabout 2 inches over placement of the pre-amplifier circuit on abaseboard. However, placement of the pre-amplifier circuit on theactuator arm has made for increasing difficult connection of thetransducer leads to the pre-amplifier terminals.

In previous disc drives, the electrical connections between theread/write transducer lead wires and the preamplifier circuit are madeby attaching the lead wires to spaced apart interconnection points orterminals on the preamplifier substrate, with the result that theconnections are horizontally spaced in a single plane. In so attachingthe lead wires, a minimum distance must be maintained between thepositions of adjacent interconnection points to prevent shorting.

A problem that has consequently arisen is that the area remainingavailable on the pre-amplifier substrate for making the interconnectionpoints for electrically connecting the transducer lead wires beyond thatneeded for the preamplifier circuit is continually decreasing. This isdue in part to the use of smaller disc drives with correspondinglysmaller rotary arms which have less room for the substrate thereon.Further, the use of increasing numbers of magnetic storage discs in asingle disc drive requires a greater number of transducers to be usedand therefore increases the number of electrical connections that mustbe made on the substrate.

SUMMARY OF THE INVENTION

The present invention provides a transducer signal terminator forproviding electrical connections between a plurality of read/writetransducers and a preamplifier circuit. The signal terminator comprisesa substrate having the preamplifier circuit formed thereon and furtherhas a plurality of intermediate strips which are attached to thesubstrate.

The pre-amplifier substrate has a plurality of head pad sets mountedthereon. Each head pad set comprises four head pads which are used toelectrically connect corresponding lead wires from one of thetransducers to the preamplifier circuit.

Each intermediate strip comprises a conductive first layer, which isdivided into four conductive pads, and an insulating second layer. Inaddition, each intermediate strip has four solder reflow holestherethrough. Each of the lead wires from a transducer is attached to aparticular conductive pad and the intermediate strip is then positionedon one of the head pad sets such that each of the holes in theintermediate strip is aligned with one of the head pads in the head padset. Each conductive pad is heated such that solder from the connectedhead pad melts and flows up through the solder reflow hole in theintermediate strip, forming an electrical path between each conductivepad and the corresponding head pad.

The intermediate strips also help prevent electrical shorting byproviding insulation between adjacent head pad sets and by drawingsolder from the head pads through the holes, thus preventing the solderfrom spilling onto adjacent head pads when the electrical connection ismade.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic representation of a top view of a portion of amagnetic disc drive.

FIG. 2 is a perspective view of the transducer signal terminator of thepresent invention.

FIG. 3 is a schematic representation of a top view of a portion of thetransducer signal terminator.

FIG. 4 is a sectional view of a portion of the transducer signalterminator taken along the line 4--4 of FIG. 3.

FIG. 5 is a schematic representation of a top view of an intermediatestrip portion of the transducer signal terminator.

FIG. 6 is a sectional view of a portion of the intermediate stripportion taken along the line 6--6 of FIG. 5.

FIG. 7 is a sectional view of a portion of the intermediate stripportion taken along the line 7--7 of FIG. 5.

FIG. 8 is a top view of an alternative embodiment of an intermediatestrip of the transducer signal terminator.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

A portion of a disc drive 10 in which a transducer signal terminator 12of the present invention is utilized is shown in FIG. 1. Disc drive 10includes a rotary arm 14 and a co-fired ceramic substrate 16 attached toa first side 18 of rotary arm 14. A plurality of head spring assemblies20, each including a read/write transducer 22, are attached to rotaryarm 14. A bundle of four lead wires 26 extend from each transducer 22 tosubstrate 16. A flexible circuit 28 is attached to rotary arm 14 betweensubstrate 16 and first side 18 and extends to a flex connector 30 whichis spaced from rotary arm 14. Flexible circuit 28 is constrained in partby a pair of brackets 32 and provides a path for electrical signalsbetween a preamplifier circuit located on substrate 16 and flexconnector 30, which is electrically connected to signal processingcircuitry (not shown).

A portion of signal terminator 12 is shown in FIG. 2 and includessubstrate 16, which has both a first layer 36 and a second layer 38, andfurther has nine intermediate circuit interconnection portions, orintermediate strips, 39. Both first layer 36 and second layer 38 ofsubstrate 16 have an outer perimeter having the general shape of arectangle. However, the shape of first layer 36 is modified to have aplurality of generally parallel rectangular slots 40 cut therein from afirst end 42 to thereby leave a plurality of generally parallelrectangular fingers 46 that extend to first end 42 on either side ofeach slot 40. Both first and second layers 36 and 38 have a thicknessgenerally between 6 and 9 mils.

A preamplifier circuit comprising a monolithic integrated circuit die49, a pair of surface mount resistors 50 and four surface mountcapacitors 52 is located on first layer 36 of substrate 16 away fromfingers 46 and is shown in FIG. 3. A plurality of head pad sets 54 arelocated on both first layer 36 and second layer 38 of substrate 16 andeach includes a first head pad 56, a second head pad 58, a third headpad 60 and a fourth head pad 62. Head pads 56,58,60,62 may be 20-50 milin diameter. Head pads 56,58,60,62 preferably comprise a solder beadattached over a copper base. Each of the head pads 56,58,60,62 areelectrically connected to the preamplifier circuit via a plurality ofelectrically conductive interconnection runs 66, some of which extendbetween first and second layers 36 and 38 of substrate 16. Head pads56,58,60,62 serve as terminals of the preamplifier circuit to receiveelectrical signals from transducer 22. The preamplifier circuit, whichhas a main preamplifier including a multiplexer, is also electricallyconnected to flexible circuit 28 by runs 66. Because each head pad set54 includes four head pads 56,58,60,62, each set 54 provides anelectrical connection to the preamplifier circuit for one of transducers22. Therefore, it is necessary to provide a head pad set 54 on substrate16 for each transducer 22 that is used in disc drive 10.

Second layer 38 of substrate 16 has four head pad sets 54 thereon whichare positioned such that each set 54 is aligned with one of slots 40 infirst layer 36. First layer 36 has five head pad sets 54 thereon, eachof which is positioned on one of fingers 46. The placement of head pads56,58,60,62 on both first layer 36 and second layer 38 of substrate 16provides a vertical separation of about 8 mils between adjacent head padsets 54 as can be seen in FIG. 4. This allows the horizontal distancebetween adjacent head pad sets 54 to be decreased without causingshorting between adjacent sets 54. This in turn allows a greater numberof head pad sets 54 to be placed on substrate 16.

An intermediate strip 39 used in signal terminator 12 is shown in moredetail in FIGS. 5 and 6. Intermediate strip 39 has both a conductivelayer 70 which is fabricated from an electrical conductor, preferablycopper, and an insulative layer 72 which is fabricated from anelectrically insulating material such as ceramic or polyimide. Fourgrooves 74 are present in conductive layer 70, exposing insulative layer72 and effectively serving as gaps or channels to separate conductivelayer 70 into four separate pads 76. Insulative layer 72 thus providesthe structure which supports and maintains the positional relationshipof each of the four separate pads 76. As shown, three of the grooves 74may be generally J-shaped, providing a partial gap between two discretesections of each of the pads 76. J-shaped grooves 74 define lead connectsections 73 toward edge 73a of intermediate strip 39. J-shaped grooves74 give these lead connect sections 73 a generally triangular shape.Lead connect sections 73 may be coated with solder plating (such aslayers of gold and/or nickel) during manufacture of intermediate strip39, so as to facilitate the subsequent connection between lead wires 26and lead connect sections 73. J-shaped grooves 74 define head padconnect sections 75 toward edge 75a of intermediate strip 39. J-shapedgrooves 74 give these head pad connect sections 75 a generally circularshape. J-shaped grooves 74 and head pad connect sections 75 should havea diameter at least as large as the diameter of their respectiveunderlying head pad 56,58,60,62. In this way, placement of intermediatestrip 39 over head pad set 54 will cause each head pad 56,58,60,62 tocontact one and only one head pad connect section 75.

Conductive layer 70 of each intermediate strip 39 is approximately 1.5mils thick while insulative layer 72 is approximately 3.0 mils thick.Conductive layer 70 is held to insulative layer 72 by an adhesive. Asecond layer of a non-insulting material such as ceramic or polyimide(not shown) may be applied over a substantial portion of conductivelayer 70 to further aid in preventing shorting of pads 76.

A tab 77 extends from a first edge 78 of intermediate strip 39 atapproximately a 45 degree angle to a top surface 79 of conductive layer70. Tab 77 is designed to aid in the manual manipulation of intermediatestrip 39. Tab 77 further aids in identifying the positional orientationof intermediate strip 39 (i.e., which end is which). Because electricalconnection of transducer 22 to the pre-amplifier circuit is dependent onidentifying the various lead wires 26 by the positional relationship oftheir lead connect sections 73, it is imperative that intermediate strip39 not be installed in a reverse position, and tab 77 helps preventreverse installation.

If the assembly process is automated, tab 77 may be designed and shapedas needed to aid in the automated fixturing for intermediate strip 39.

Tab 77 is preferably part of conductive layer 70, but could also befabricated from insulative layer 72. Tab 77 may or may not be removablefrom intermediate strip 39 when strip 39 is finally placed in disc drive10. Except for first edge 78, each edge of conductive layer 70 is setback or inwardly removed from the corresponding edge of insulative layer72 by approximately 2 mils. This setback aids in avoiding shorting ofeach of the pads 76 along the edge of intermediate strip 39.

As an alternative embodiment, intermediate strip 39 may have a larger,removable test section 102, shown in FIG. 8. Test section 102 hasterminals 104 electrically connected to each of the pads 76. As can beseen, terminals 104 are significantly larger than pads 76, and testsection 102 aids in electrically connecting transducer 22 to a testcircuit (not shown). In this way transducer 22 can be readily"fly-tested" (i.e., testing of the signals created as the transducerflies over a disc surface, perhaps including parametric testing such asamplitude and pulse width testing) prior to complete assembly of discdrive 10. After testing is completed, test section 102 may be removedfrom intermediate strip 39 by severing along separation line 107.

As shown, two or more intermediate strips 39 may be initially fabricatedas a single unit, together with their respective test sections 102.Because the larger test terminals 104 would occupy too much space in thefinal disc drive 10, they are removed prior to electrical connection ofintermediate strip 39 to head pad sets 54 and the pre-amplifier circuit.Test section 102 is formed out of the same insulative layer 72 ofintermediate strip 39 (preferably 3.0 mil thick KAPTON, a flexiblepolyimide material from DuPont), and test terminals 104 are formed outof the conductive layer 70 (preferably 1.5 mil thick copper). Similar totab 77, test sections 102 may be designed and shaped as needed to aid inthe automated fixturing for intermediate strip 39, such as by holes 106.

As shown in FIGS. 5 and 6, first cavity 80, a second cavity 82, a thirdcavity 84 and a fourth cavity 86 extend through intermediate strip 39.Each of cavities 80,82,84,86 comprises a generally cylindrical firsthole 90 in conductive layer 70 and a generally cylindrical second hole92 in insulative layer 72. Each first hole 90 is centered about the sameaxis as the corresponding second hole 92 and has a diameter ofapproximately 8-10 mils. Second hole 92 has a diameter of approximately20-30 mils and has an inner surface 94 which is plated with solder.First holes 90, as well as grooves 74, are preferably formed by etchingwhile second holes 92 are preferably formed through the use of amechanical punch or a laser. Cavities 80,82,84,86 and corresponding headpad connect sections 75 can be linearly arranged on intermediate strip39. As shown, head pad connect sections 75 are offset both linearly(i.e., not in the same line as) and transversely (i.e., not directlyunderneath) from lead connect sections 73. This offset provides betterseparation of head pad connect sections 75 and lead connect sections 73,while still maintaining electrical continuity.

The electrical connection of transducers 22 to the pre-amplifier willnow be described. First, lead wires 26 from transducer 22 areelectrically connected to intermediate strip 39 as shown in FIG. 5.Preferred lead wires 26 are about 1.5 mil in diameter, made from asingle strand of copper wire coated with 1 to 4 layers of polyurethaneor nylon insulation. The insulation layers are only a few tenths of amil thick, and may be transparent or translucent. Because lead wires 26will be identified by the pad 76 to which they are attached, it is notnecessary that the insulation layer be colored.

A first lead wire 26 is electrically connected to a first pad 76 on thetop side of that pad's lead connect section 73. This connection may bemade through any known means, but soldering or ultrasonic or stitchwelding is preferred. The connection of first lead wire 26 orients leadwire 26 such that it generally runs longitudinally along intermediatestrip 39. When disc drive 10 is fully assembled, this orientation oflead wires 26 helps to avoid contact and/or confusion between lead wires26 from adjacent intermediate strips 39. After attachment to leadconnect section 73 of the first pad 76, the first lead wire 26 isattached to the corresponding terminal (say, for example, the negativewrite terminal) on transducer 22. This attachment is again preferablymade through ultrasonic or stitch welding. Using our example, the firstpad 76 with first cavity 80 is thus defined as the negative write pad 76on the intermediate strip 39.

After the first (negative write) lead wire 26 is electrically connectedboth to its lead connect section 73 and its transducer terminal, eachsubsequent lead wire 26 (positive write, negative MR read and positiveMR read) is similarly connected. Because both ends of each lead wire 26are attached prior to introduction of additional lead wires 26, there isno opportunity for confusion over the polarity of any particular leadwire 26, and lead wires 26 are identified by the particular pad 76 towhich they are attached.

Workers skilled in the art will recognize that the particular order ofpolarities and order of connections is not important so long as eachtransducer terminal can be identified by the location of the attachedpad 76. Similarly, workers skilled in the art will appreciate that pads76 need not be arranged linearly, and for instance could be arranged ina rectangular fashion, so long as intermediate strip 39 identifiesdiscrete locations associated with each particular lead wire 26 oftransducer 22.

FIG. 5 depicts intermediate strip 39 after all four lead wires 26 havebeen connected. Lead wires 26 are shown in dashed line form over aportion of intermediate strip 39 to avoid obscuring the view ofintermediate strip 39. A thin layer of an encapsulant 100 is preferablyplaced over the connection between each lead wire 26 and correspondingpad 76 as shown in FIGS. 5 and 7. Encapsulant 100 may be an adhesive orother substance which helps to provide strain relief and absorb thephysical stresses that may be placed on lead wires 26, thereby helpingto preserve the connection between each lead wire 26 and copper pad 76.Encapsulant 100 also helps to captivate any loose flakes of insulationcaused by the soldering or welding of lead wire 26. The epoxy may becured through application of ultraviolet light in a matter of a fewseconds. Grooves 74 act as a barrier or moat to prevent encapsulant 100from flowing into cavities 80,82,84,86. Having lead connect sections 73offset both linearly and transversely from head pad connect sections 75further aids in preventing encapsulant 100 from flowing into cavities80,82,84,86.

After all lead wires 26 are attached between intermediate strip 39 andthe terminals of transducer 22, wires 26 are preferably twisted into abundle. The twisting of wires 26 terminates approximately a quarter inchaway from both transducer 22 and intermediate strip 39, thus allowingseparation of wires 26 for their respective attachments. A bundle oflead wires 26 is easier to work with than individual lead wires 26. Asshown in FIG. 1, the bundle runs down rotary arm 14 and head springassembly 20 to transducer 22. The bundle is preferably held in place onrotary arm 14 and head spring assembly 20 by several drops of glueplaced at spaced locations along the wire bundle.

After intermediate strip 39 is fully connected to transducer 22,intermediate strip 39 is positioned on the appropriate head pad set 54such that first end 78 of intermediate strip 39 faces an inner end 110of slot 40 or an inner end 112 of finger 46 as shown in FIGS. 2 and 3.Intermediate strips 39 are positioned likewise for each transducer 22.When intermediate strips 39 are so positioned, each one of first,second, third and fourth cavities 80,82,84,86 is aligned with acorresponding one of first, second, third and fourth head pads56,58,60,62, respectively, and a bottom side 114 of insulative layer 72contacts substrate 16. Because head pads 56,58,60,62 are larger indiameter than the corresponding holes 90, some tolerance in placement ofintermediate strip 39 is provided while still aligning cavities80,82,84,86 over head pads 56,58,60,62 for electrical connection.Similarly, head pads 56,58,60,62 may be horizontally elongated (notshown) to provide tolerance for the length of lead wires 26.

Intermediate strips 39 are preferably attached to substrate 16 byheating each pad 76. The heat melts the solder plated on inner surface94 of each corresponding second hole 92, as well as the solder of thecorresponding one of head pads 56,58,60,62. The solder may be drawn upthrough each of cavities 80,82,84,86 to form an electrical connectionbetween each pad 76 and corresponding one of head pads 56,58,60,62. Themelting of the solder forms a bond holding intermediate strip 39 inplace on substrate 16. A solder bead may form on the exterior of hole90, thus forming a solder rivet to further hold intermediate strip 39 tosubstrate 16. By drawing the solder from head pads 56,58,60,62 upthrough each of cavities 80,82,84,86, the solder is prevented fromflowing between intermediate strip 39 and substrate 16 when melted. Thishelps to prevent shorts between adjacent head pads 56,58,60,62 andbetween adjacent head pad sets 54. The dimensions of cavities80,82,84,86 will greatly affect the amount of solder that is drawntherethrough. The intermediate strips 39 may alternatively beelectrically and physically attached to head pad sets 54 by other knownmeans, such as ultrasonic or stitch welding. A secondary method ofretaining intermediate strip 39 against substrate 16 may also be used,particularly if a method of electrical connection other than solderingis employed.

An encapsulant is placed on first layer 36 of substrate 16 to cover die49 and a plurality of die bonds 108, shown in FIG. 3. The encapsulantpreferably comprises HYSOL 4401 but can also comprise a variety of othermaterials. Substrate 16 is held in place on rotary arm 14 through theuse of two pins 120 which are attached to rotary arm 14 and extendthrough substrate 16 and through openings in connection pads 122. Pins120 are then soldered in place, holding substrate 16 on first side 18 ofrotary arm 14.

By providing vertical separation between adjacent head pad sets 54, thedistance between head pad sets 54 is increased over the previouspractice of having interconnection points horizontally spaced in asingle plane, helping to prevent electrical shorts between adjacent headpad sets 54. Intermediate strips 39 also help to prevent electricalshorts between adjacent head pad sets 54 through the use ofnon-conductive insulative layer 72. In addition, intermediate strips 39help to prevent electrical shorts between adjacent head pad sets 54 bydrawing solder up from head pads 56,58,60,62 through cavities80,82,84,86. Each of these factors permits a greater number of head padsets 54 to be placed on substrate 16 and thus permits a greater numberof electrical connections to be made between the preamplifier circuitand transducer lead wires 26.

The use of vertically separated substrate layers 36 and 38, along withthe use of slots 40 also helps to align transducer lead wires 26 withrespect to substrate 16. The use of intermediate strips 39 allows theelectrical connections between transducers 22 and the preamplifiercircuit to be made more easily. This is because lead wires 26 are firstattached to each intermediate strip 39 which can then more easily beattached to substrate 16 than if lead wires 26 are directly connected tohead pad sets 54. Although described as having two layers on which headpads sets 54 are located, substrate 16 can have additional layers onwhich head pad sets 54 may be located. While nine head pad sets 54 weredescribed as having four head pads 56,58,60,62 each, any number of headpad sets 54 can be placed on substrate 16 subject only to the physicallimitations of substrate 16. Further, head pad sets 54 can have anynumber of head pads therein and can be arranged in any of a variety ofconfigurations.

While substrate 16 was described as having a first layer 36 and a secondlayer 38 only, substrate 16 can have a plurality of additional layers aswell. These layers can be used not only to provide further verticalspacing between head pad sets 54, but can be used to provide more runs66 between head pads 56,58,60,62 and the preamplifier circuit.

Although the present invention has been described with reference topreferred embodiments, workers skilled in the art will recognize thatchanges may be made in form and detail without departing from the spiritand scope of the invention. For instance, several of the features hereindescribed may be omitted or altered while not departing from theinvention claimed.

What is claimed is:
 1. An intermediate strip adapted to electricallyconnect a read-write transducer to a pre-amplifier circuit in a computerdisc drive, the read-write transducer having a plurality of distinctleads and the pre-amplifier circuit having corresponding terminals foreach of the read-write transducer leads, the intermediate stripcomprising:a support structure of an electrically insulative material;and a plurality of generally planar electrically conductive pads on thesupport structure, each of the pads being for electrical connection toone of the leads for the read-write transducer and to the correspondingterminal of the pre-amplifier circuit, each of the pads beingelectrically insulated from the other pads, wherein each of theelectrically conductive pads comprisesa first side exposed forelectrical connection to one of the leads for the read-write transducer,the first side facing in a direction, and a second side facingoppositely from the direction the first side faces, the second sideexposed for electrical connection to a corresponding terminal of thepre-amplifier circuit; wherein the location of each of the electricallyconductive pads on the support structure designates the intended lead ofthe read-write transducer.
 2. The intermediate strip of claim 1whereinthe support structure is of polyimide.
 3. The intermediate stripof claim 1 whereinthe electrically conductive pads are of copper.
 4. Theintermediate strip of claim 1 wherein the electrically conductive padsare comprised of:a layer of electrically conductive material positionedacross a surface of the support structure, the layer being separatedinto electrically conductive pads.
 5. The intermediate strip of claim 4wherein the layer of electrically conductive material has an edge whichis inwardly displaced from an edge of the support structure.
 6. Theintermediate strip of claim 1 wherein the plurality of electricallyconductive pads further comprise:a first electrically conductive pad forelectrical connection to a positive lead for an MR read transducer; anda second electrically conductive pad for electrical connection to anegative lead for an MR read transducer.
 7. The intermediate strip ofclaim 1, wherein the intermediate strip further comprises:test terminalselectrically connected to the electrically conductive pads.
 8. Theintermediate strip of claim 7, wherein the test terminals are removable.9. The intermediate strip of claim 1 wherein each of the electricallyconductive pads further comprise:a first discrete section for electricalconnection to one of the leads for the read-write transducer; and asecond discrete section for electrical connection to the correspondingpre-amplifier terminal.
 10. The intermediate strip of claim 9 whereineach of the second discrete sections define a hole therethrough.
 11. Theintermediate strip of claim 9wherein each of the first discrete sectionsare exposed for electrical connection on the first side; and whereineach of the second discrete sections are exposed for electricalconnection on the second side.
 12. The intermediate strip of claim 11wherein the support structure defines base openings which expose thesecond discrete sections on the second side.
 13. The intermediate stripof claim 9 wherein the electrically conductive pads are comprised of:alayer of electrically conductive material positioned across a surface ofthe support structure, the layer having partial gaps to separate thefirst discrete sections from the second discrete sections.
 14. Theintermediate strip of claim 9 wherein the second discrete sectionsprovide generally triangular electrical connection surfaces.
 15. Theintermediate strip of claim 9 wherein the electrically conductive padsare positioned in a linear relationship.
 16. The intermediate strip ofclaim 15 wherein the second discrete sections are linearly andtransversely offset from the first discrete sections.
 17. Anintermediate strip adapted to electrically connect a read-writetransducer to a pre-amplifier circuit in a computer disc drive, theread-write transducer having a plurality of distinct leads and thepre-amplifier circuit having corresponding terminals for each of theread-write transducer leads, the intermediate strip comprising:a supportstructure of an electrically insulative material; and a plurality ofelectrically conductive pads on the support structure, each of the padsbeing for electrical connection to one of the leads for the read-writetransducer and to the corresponding terminal of the pre-amplifiercircuit, each of the pads being electrically insulated from the otherpads; wherein each of the electrically conductive pads furthercomprise:a first discrete section for electrical connection to one ofthe leads for the read-write transducer; and a second discrete sectionfor electrical connection to the corresponding pre-amplifier terminalwherein the location of each of the electrically conductive pads on thesupport structure designates the intended lead of the read-writetransducer. wherein the electrically conductive pads are comprised of:alayer of electrically conductive material positioned across a surface ofthe support structure, the layer having partial gaps to separate thefirst discrete sections from the second discrete sections; wherein thepartial gaps are etched "J-shaped" grooves.
 18. A computer disc drivecomprising:a read-write transducer having a plurality of distinct leads;an intermediate strip comprising:a support structure of an electricallyinsulative material; and a plurality of generally planar electricallyconductive pads on the support structure, each of the pads having afirst side which is electrically connected to one of the leads for theread-write transducer, each of the pads having a second side oppositethe first side, each of the pads being electrically insulated from theother pads; and a pre-amplifier circuit having corresponding terminalsfor each of the read-write transducer leads, each corresponding terminalbeing electrically connected to the second side of one of theelectrically conductive pads; wherein the location of each of theelectrically conductive pads on the intermediate strip designates theconnected lead of the read-write transducer and the connectedcorresponding terminal of the pre-amplifier circuit.
 19. The computerdisc drive of claim 18 wherein the corresponding terminalscomprise:solder which holds the intermediate strip in place and provideselectrical connections with the electrically conductive pads.
 20. Thecomputer disc drive of claim 19 wherein each of the electricallyconductive pads further comprise:a discrete section for connection tothe corresponding pre-amplifier terminal, the discrete section defininga solder reflow hole.
 21. The computer disc drive of claim 20 whereinthe solder reflow hole has a diameter of 0.008-0.010 inches.
 22. Thecomputer disc drive of claim 18:wherein each of the electricallyconductive pads further comprise a discrete section for connection tothe corresponding pre-amplifier terminal, the discrete section defininga solder reflow hole; and wherein each of the correspondingpre-amplifier terminals further comprise a solder pad which is largerthan the solder reflow hole.
 23. The computer disc drive of claim 22wherein the solder pads are elongated.
 24. The computer disc drive ofclaim 18 further comprising a soldered connection of each of thedistinct transducer leads to its electrically conductive pad, eachsoldered connection being covered by an encapsulating epoxy.
 25. Thecomputer disc drive of claim 24, wherein the encapsulating epoxy isultraviolet cured epoxy.
 26. The computer disc drive of claim 18 whereinthe support structure defines a longitudinal direction, and wherein theconnection of each of the leads to its electrically conductive padorients each of the leads in the longitudinal direction.
 27. A methodfor electrically connecting a transducer to a pre-amplifier in acomputer disc drive, the method comprising:electrically connecting afirst side of a first generally planar electrically conductive pad on anintermediate strip to a first distinct terminal of the transducer;electrically connecting a first side of a second generally planarelectrically conductive pad on the intermediate strip to a seconddistinct terminal of the transducer, wherein the location of the firstand second electrically conductive pads designates the transducerterminal connected thereto; and positioning the intermediate strip suchthat a second side opposite the first side of the first electricallyconductive pad makes electrical contact to a first correspondingterminal of the pre-amplifier and a second side opposite the first sideof the second electrically conductive pad makes electrical contact to asecond corresponding terminal of the pre-amplifier.
 28. The method ofclaim 27 wherein the step of electrically connecting the firstelectrically conductive pad comprises:ultrasonically welding a lead wireto the first electrically conductive pad.
 29. The method of claim 27wherein the step of electrically connecting the first electricallyconductive pad comprises:soldering a lead wire to the first electricallyconductive pad.
 30. The method of claim 27 further comprising:covering aconnection of a lead wire on the first electrically conductive pad withan encapsulating epoxy.
 31. The method of claim 30 furthercomprising:curing the encapsulating epoxy by exposure to ultravioletlight.
 32. The method of claim 27 wherein the step of positioning theintermediate strip comprises:ultrasonically welding the electricallyconductive pad to a terminal of the pre-amplifier circuit.
 33. Themethod of claim 27 wherein the step of positioning the intermediatestrip comprises:soldering the electrically conductive pad to a terminalof the pre-amplifier circuit.
 34. The method of claim 27 wherein theelectrical connection of the first electrically conductive pad to thefirst distinct terminal of the transducer is through a first wire andwherein the electrical connection of the second electrically conductivepad to the second distinct terminal of the transducer is through asecond wire, the method further comprising:twisting the first wire andthe second wire into a bundle.
 35. The method of claim 34 furthercomprising:attaching the bundle to an actuator arm which carries thetransducer in the computer disc drive.